放电等离子烧结CuIn5合金的工艺优化

doi:10.13251/j.issn.0254-6051.2022.07.013

金属热处理 ›› 2022, Vol. 47 ›› Issue (7): 76-80.DOI: 10.13251/j.issn.0254-6051.2022.07.013

放电等离子烧结CuIn₅合金的工艺优化

樊帅奇¹, 李海涛¹, 王雪松², 张蕾涛¹, 徐金富², 戴姣燕²

1.长安大学材料科学与工程学院, 陕西西安 710061;
2.宁波工程学院材料与化学工程学院, 浙江宁波 315211

收稿日期:2022-02-16 修回日期:2022-05-19 出版日期:2022-07-25 发布日期:2022-08-12
通讯作者: 戴姣燕,博士, E-mail:djy211@163.com
作者简介:樊帅奇(1996—),男,硕士研究生,主要研究方向为高强高导铜合金,E-mail:1445848185@qq.com。
基金资助:
宁波市2025重大专项(2019B10084)

Process optimization of CuIn₅ alloy prepared by sparking plasma sintering

Fan Shuaiqi¹, Li Haitao¹ , Wang Xuesong², Zhang Leitao¹, Xu Jinfu², Dai Jiaoyan²

1. School of Materials Science and Engineering, Chang'an University, Xi'an Shaanxi 710061, China;
2. School of Materials Science and Chemical Engineering, Ningbo University of Technology, Ningbo Zhejiang 315211, China

Received:2022-02-16 Revised:2022-05-19 Online:2022-07-25 Published:2022-08-12

摘要/Abstract

摘要： 采用正交试验法确定了CuIn₅合金放电等离子烧结(SPS)的最佳工艺参数,研究了烧结温度、烧结时间、烧结压力对CuIn₅合金的致密度、硬度和导电性能的影响。结果表明:影响CuIn₅合金致密度和硬度的主要因素均为烧结温度,其次为烧结压力,烧结时间的影响最小;影响CuIn₅合金电导率的主要因素为烧结温度,其次为烧结时间和烧结压力。利用SPS技术制备CuIn₅合金的最佳工艺为烧结温度850 ℃,烧结时间5 min,烧结压力50 MPa。采用最佳工艺制备的CuIn₅合金组织均匀致密,In固溶于Cu中形成固溶体,其晶格常数为0.362 865 nm,晶格畸变率为0.38%,致密度为99.56%,显微硬度为136.3 HV0.1,导电率为37.86%IACS。

关键词: 放电等离子烧结, Cu-In合金, 烧结工艺, 组织性能

Abstract: Optimum parameters of spark plasma sintering (SPS) process of CuIn₅ alloy were determined by orthogonal experiment. The effect of sintering temperature, sintering time and sintering pressure on density, hardness and electrical conductivity of the CuIn₅ alloy was studied. The results show that the main factor affecting density and hardness of the CuIn₅ alloy is sintering temperature, followed by sintering pressure, and sintering time has the least effect; the main factors affecting the conductivity of the CuIn₅ alloy is sintering temperature, followed by sintering time and sintering pressure. The optimum process for preparing CuIn₅ alloy by SPS process consists of sintering temperature of 850 ℃, sintering time of 5 min and sintering pressure of 50 MPa. The microstructure of CuIn₅ alloy prepared by the best process is uniform and compact, In is dissolved in Cu to form a solid solution, the lattice constant is 0.362 865 nm, the lattice distortion is 0.38%, the density is 99.56%, the microhardness is 136.3 HV0.1, and the conductivity is 37.86%IACS.

Key words: spark plasma sintering, Cu-In alloy, sintering process, microstructure and properties

中图分类号:

TG146.23

樊帅奇, 李海涛, 王雪松, 张蕾涛, 徐金富, 戴姣燕. 放电等离子烧结CuIn₅合金的工艺优化[J]. 金属热处理, 2022, 47(7): 76-80.

Fan Shuaiqi, Li Haitao , Wang Xuesong, Zhang Leitao, Xu Jinfu, Dai Jiaoyan. Process optimization of CuIn₅ alloy prepared by sparking plasma sintering[J]. Heat Treatment of Metals, 2022, 47(7): 76-80.

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放电等离子烧结CuIn₅合金的工艺优化

Process optimization of CuIn₅ alloy prepared by sparking plasma sintering

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