冷拉拔铜线强度和微观组织的演化机制定量研究

doi:10.13251/j.issn.0254-6051.2024.10.028

金属热处理 ›› 2024, Vol. 49 ›› Issue (10): 169-174.DOI: 10.13251/j.issn.0254-6051.2024.10.028

冷拉拔铜线强度和微观组织的演化机制定量研究

范雪圆^1,2, 王硕², 顾建³, 张振军², 李冬青³, 刘增乾^1,2, 侯嘉鹏², 张哲峰^1,2

1.郑州大学河南先进技术研究院, 河南郑州 450001;
2.中国科学院金属研究所沈阳材料科学国家实验室, 辽宁沈阳 110016;
3.中国电力科学研究院有限公司, 北京 102401

收稿日期:2024-05-13 修回日期:2024-08-19 出版日期:2024-11-28 发布日期:2024-11-28
通讯作者: 侯嘉鹏,副研究员,博士,E-mail: jphou@imr.ac.cn
作者简介:范雪圆(1999—),女,硕士研究生,主要研究方向为高性能铜导体材料,E-mail: 1054422987@qq.com。
基金资助:
国家电网浙江省电力公司项目(5211HD190002)

Quantitative study on evolution mechanisms of strength and microstructure of cold drawn Cu wire

Fan Xueyuan^1,2, Wang Shuo², Gu Jian³, Zhang Zhenjun², Li Dongqing³, Liu Zengqian^1,2, Hou Jiapeng², Zhang Zhefeng^1,2

1. Henan Institute of Advanced Technology, Zhengzhou University, Zhengzhou Henan 450001, China;
2. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang Liaoning 110016, China;
3. China Electric Power Research Institute, Beijing 102401, China

Received:2024-05-13 Revised:2024-08-19 Online:2024-11-28 Published:2024-11-28

摘要/Abstract

摘要： 通过冷拉拔制备了3种不同应变量的铜线,研究了铜线强度和微观组织与应变量的关系。结果表明,冷拔过程中铜线强度呈现出前期增长较快、后期增长缓慢的变化趋势。微观表征发现,冷拔过程中铜线晶粒宽度不断减小,晶粒取向逐渐从<001>向<111>转动,最终形成了高比例的<111>织构,位错密度呈现先增大再下降的规律。进一步建立的微观组织与强度的定量关系发现,晶界强化和位错强化是拉拔初期铜线强度大幅增加的根本原因;而变形后期晶界强化和织构强化的增加以及位错强化的显著下降是拉拔后期铜线强度增加缓慢的主要机制。

关键词: 纯铜线, 冷拉拔, 强度, 微观组织

Abstract: Three types of Cu wires with different deformation strains were prepared by the cold drawing process. The relationship between the strength, microstructure and strains of the Cu wires was studied. The results show that during the cold drawing process, the strength of the Cu wire shows a trend of rapid increase in the early drawing stage and slow increase in the later drawing stage. Microstructure observations reveal that the grain width of the Cu wire decreases continuously, and the grain orientation gradually rotates from <001> to <111>, forming a high proportion of <111> texture. Additionally, the dislocation density first increases and then decreases with the increase of drawing strains. Further established quantitative relationship between the microstructure and the strength reveals that the grain boundary strengthening and dislocation strengthening are the fundamental reasons for the significant increase in strength of Cu wires during the initial drawing stage. While, the main mechanism for the slow increase in strength of Cu wires in the later stage of drawing is the increase in fine grain strengthening and texture strengthening, as well as the significant decrease in dislocation strengthening.

Key words: pure Cu wire, cold drawing, strength, microstructure

中图分类号:

TG359

范雪圆, 王硕, 顾建, 张振军, 李冬青, 刘增乾, 侯嘉鹏, 张哲峰. 冷拉拔铜线强度和微观组织的演化机制定量研究[J]. 金属热处理, 2024, 49(10): 169-174.

Fan Xueyuan, Wang Shuo, Gu Jian, Zhang Zhenjun, Li Dongqing, Liu Zengqian, Hou Jiapeng, Zhang Zhefeng. Quantitative study on evolution mechanisms of strength and microstructure of cold drawn Cu wire[J]. Heat Treatment of Metals, 2024, 49(10): 169-174.

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冷拉拔铜线强度和微观组织的演化机制定量研究

Quantitative study on evolution mechanisms of strength and microstructure of cold drawn Cu wire

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