时效时间对Cu/In-Sn-2.5Ag/Cu焊点组织形貌及剪切性能的影响

doi:10.13251/j.issn.0254-6051.2021.09.017

金属热处理 ›› 2021, Vol. 46 ›› Issue (9): 104-107.DOI: 10.13251/j.issn.0254-6051.2021.09.017

时效时间对Cu/In-Sn-2.5Ag/Cu焊点组织形貌及剪切性能的影响

乔健¹, 刘政², 高惠明³, 杨莉^1,2

1.苏州大学机电工程学院, 江苏苏州 215000;
2.桂林航天工业学院机械工程学院, 广西桂林 541004;
3.国家模具质量监督检验中心, 江苏昆山 215300

收稿日期:2021-03-28 出版日期:2021-09-25 发布日期:2021-12-09
通讯作者: 刘政,高级工程师,E-mail:liuzheng@guat.edu.cn
作者简介:乔健(1994—),男,硕士研究生,主要研究方向为材料加工及电子封装技术,E-mail:1090979396@qq.com。
基金资助:
国家自然科学基金(51865006);广西自然科学基金(2020GXNSFAA297004);广西高校中青年教师科研基础能力提升项目(2021KY0787)

Effect of aging time on microstructure and shear properties of Cu/In-Sn-2.5Ag/Cu solder joint

Qiao Jian¹, Liu Zheng², Gao Huiming³, Yang Li^1,2

1. School of Mechanical and Electrical Engineering, Soochow University, Suzhou Jiangsu 215000, China;
2. School of Mechanical Engineering, Guilin University of Aerospace Technology, Guilin Guangxi 541004, China;
3. National Diesand Molds Quality Supervision Test Center, Kunshan Jiangsu 215300, China

Received:2021-03-28 Online:2021-09-25 Published:2021-12-09

摘要/Abstract

摘要： 研究了Cu/In-Sn-2.5Ag/Cu复合钎料焊点在125 ℃时效不同时间后的微观组织和剪切性能。结果表明:随着时效时间的延长,Cu/In-Sn-2.5Ag/Cu焊点界面金属间化合物(IMCs)层厚度呈现增加的趋势,焊点界面IMCs层组织先生成Cu₆(In, Sn)₅相,同时焊点中生成少量的Ag₉In₄相,随着时效时间的延长,钎料与Cu原子进一步反应生成Cu₃(In, Sn),部分Ag₉In₄转变为Ag₃In。当时效时间为168 h,形成全IMCs焊点。焊点剪切强度随时效时间延长呈现先增大后减小的趋势,时效时间为120 h时剪切强度最大,达到15.38 MPa。

关键词: Cu/In-Sn-2.5Ag/Cu焊点, 时效时间, 金属间化合物, 剪切强度

Abstract: Microstructure and shear properties of the Cu/In-Sn-2.5Ag/Cu composite solder joint aged at 125 ℃ for different time were studied. The results show that the thickness of intermetallic compounds (IMCs) layer at the interface of the Cu/In-Sn-2.5Ag/Cu solder joint increases with the increase of aging time. Cu₆ (In, Sn)₅ phase is first formed at the interface, and a small number of Ag₉In₄ phases are produced in the solder. Cu₃(In, Sn) phase is generated by the further reaction of Cu atoms with the solder, and a part of Ag₉In₄ phase transforms into Ag₃In phase with the increase of aging time. The solder joint full of IMCs is formed when the aging time extends to 168 h. The shear strength of the solder joint increases first and then decreases with the increase of aging time. The shear strength reaches a maximum of 15.38 MPa when the aging time is 120 h.

Key words: Cu/In-Sn-2.5Ag/Cu solder joint, aging time, intermetallic compounds, shear strength

中图分类号:

TG156

乔健, 刘政, 高惠明, 杨莉. 时效时间对Cu/In-Sn-2.5Ag/Cu焊点组织形貌及剪切性能的影响[J]. 金属热处理, 2021, 46(9): 104-107.

Qiao Jian, Liu Zheng, Gao Huiming, Yang Li. Effect of aging time on microstructure and shear properties of Cu/In-Sn-2.5Ag/Cu solder joint[J]. Heat Treatment of Metals, 2021, 46(9): 104-107.

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时效时间对Cu/In-Sn-2.5Ag/Cu焊点组织形貌及剪切性能的影响

Effect of aging time on microstructure and shear properties of Cu/In-Sn-2.5Ag/Cu solder joint

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