金属热处理 ›› 2024, Vol. 49 ›› Issue (1): 90-95.DOI: 10.13251/j.issn.0254-6051.2024.01.013

• 材料研究 • 上一篇    下一篇

40Cr/Q345B双金属复合行为及界面组织演变

原海瑞, 陈玉波, 王培杰, 李振江   

  1. 太原科技大学 材料科学与工程学院 金属材料成型理论与技术山西省重点实验室, 山西 太原 030024
  • 收稿日期:2023-08-02 修回日期:2023-11-03 发布日期:2024-02-29
  • 通讯作者: 李振江,博士,E-mail: lizj@tyust.edu.cn
  • 作者简介:原海瑞(1997—),男,硕士,主要研究方向为材料成型先进制造技术与设备,E-mail: 1034055262@qq.com。
  • 基金资助:
    山西省基础研究计划(202203021211207);山西省科技创新人才团队专项 (202204051001002)

40Cr/Q345B bimetallic composite behavior and interfacial microstructure evolution

Yuan Hairui, Chen Yubo, Wang Peijie, Li Zhenjiang   

  1. Shanxi Key Laboratory of Metal Forming Theory and Technology, School of Materials Science and Engineering, Taiyuan University of Science and Technology, Taiyuan Shanxi 030024, China
  • Received:2023-08-02 Revised:2023-11-03 Published:2024-02-29

摘要: 对40Cr/Q345B双金属材料进行热压缩温度为1000~1200 ℃、应变速率为0.01 s-1、压下量为10%~50%的真空扩散连接试验,分析了热压缩温度和压下量对双金属材料应力-应变曲线及结合界面的影响。结果表明,应力-应变曲线的峰值应力随热压缩温度的升高而减小,而对压下量的变化不敏感;双金属界面在低温低压下量条件下时存在未结合区,随着热压缩温度和压下量的增加,界面间隙消失,马氏体逐渐穿过界面,界面处晶粒由直晶界向弯曲晶界转变,直至界面消失,双金属形成了冶金结合。

关键词: 40Cr/Q345B双金属, 热压缩, 界面, 显微组织, 晶粒

Abstract: Vacuum diffusion bonding test of 40Cr/Q345B bimetallic material was carried out under the hot compression temperature of 1000-1200 ℃, strain rate of 0.01 s-1 and reduction of 10%-50%. The effects of hot compression temperature and reduction on the stress-strain curve and bonding interface of the bimetallic material were analyzed. The results show that the peak stress of the stress-strain curve decreases with the increase of hot compression temperature, but is not sensitive to the change of the reduction. There is an unbound zone at the interface under the condition of low temperature and low reduction. With the increase of hot compression temperature and reduction, the unbound zone at the interface disappears, the martensite gradually passes through the interface, and the grains at the interface change from straight grain boundary to curved grain boundary until the interface disappears, and the metallurgical bonding forms.

Key words: 40Cr/Q345B bimetal, hot compression, interface, microstructure, grain

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