金属热处理 ›› 2020, Vol. 45 ›› Issue (8): 43-46.DOI: 10.13251/j.issn.0254-6051.2020.08.009

• 组织与性能 • 上一篇    下一篇

相变诱导塑性钢TRIP590的烘烤硬化特性

王文英1, 王慧1, 曲世永1,2   

  1. 1.烟台南山学院 工学院, 山东 烟台 265713;
    2.山东南山铝业股份有限公司 国家铝合金压力加工工程技术研究中心, 山东 烟台 265700
  • 收稿日期:2020-01-27 出版日期:2020-08-25 发布日期:2020-09-07
  • 作者简介:王文英(1981—),女,副教授,主要研究方向为金属材料加工,E-mail: wangwenying@nanshan.edu.cn
  • 基金资助:
    山东省自然科学基金(ZR2016EMP05)

Bake hardening behavior of transformation induced plasticity steel TRIP590

Wang Wenying1, Wang Hui1, Qu Shiyong1,2   

  1. 1. College of Engineering, Yantai Nanshan University, Yantai Shandong 265713, China;
    2. National Engineering Research Center for Plastic Working of Aluminum Alloys, Shandong Nanshan Aluminum Co. , Ltd. , Yantai Shandong 265700, China
  • Received:2020-01-27 Online:2020-08-25 Published:2020-09-07

摘要: 采用拉伸试验机、扫描电镜(SEM)和透射电镜(TEM)等手段研究了预应变处理+烘烤工艺对TRIP590试验钢烘烤硬化(BH)特性的影响。结果表明:试验钢微观组织主要由75.5%的铁素体+15.0%的贝氏体+9.5%的残留奥氏体(体积分数)组成。随着预应变量的增大,BH值呈现增大的趋势,且前期的增长幅度较大。预应变由2%增加到8%时,BH值由22 MPa增大到88 MPa,达到最大值。随烘烤时间的延长和烘烤温度的提高,BH值均呈现增加的趋势。BH值变化规律与内耗峰值变化规律一致,证明了TRIP590钢烘烤硬化现象的柯氏气团钉扎本质。经2%预应变+烘烤处理后,基体内部可以明显看到固溶原子对位错的钉扎现象。

关键词: TRIP590钢, 烘烤硬化, 微观结构, 位错钉扎

Abstract: Influence of pre-strain and bake praess on the bake hardening(BH) behavior of TRIP590 steel was investigated by using tensile tester, SEM and TEM. The results indicate that the tested steel microstructure is composed of 75.5%ferrite+15.0%bainite+9.5%retained austenite (volume fraction). The BH value is increased with the increase of pre-strain, and the increase in the early stage is larger. The BH value is increased from 22 MPa to its maximum value 88 MPa when the strain is increased from 2% to 8%. The BH value shows a trend of increasing with the increase of both the bake time and the bake temperature. Variation of the BH value is consistent with that of internal friction, confirming the mechanism of Cottrell nailing. After 2% pre-strain+baking, the pinning phenomenon of dislocation by solution atoms can be found in the matrix.

Key words: TRIP590 steel, bake hardening, microstructure, dislocation pinning

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