表面粗糙度对磁控溅射纯Cu靶材刻蚀区表面形貌及溅射性能的影响

doi:10.13251/j.issn.0254-6051.2021.08.044

金属热处理 ›› 2021, Vol. 46 ›› Issue (8): 230-235.DOI: 10.13251/j.issn.0254-6051.2021.08.044

表面粗糙度对磁控溅射纯Cu靶材刻蚀区表面形貌及溅射性能的影响

杨文灏^1,2, 鲍明东¹, 唐宾², 王钰鹏², 赵国华³, 王帅康², 王铎³

1.宁波工程学院材料与化学工程学院, 浙江宁波 315211;
2.太原理工大学材料科学与工程学院, 山西太原 030024;
3.长安大学材料科学与工程学院, 陕西西安 710061

收稿日期:2021-03-27 出版日期:2021-08-25 发布日期:2021-12-09
通讯作者: 鲍明东,教授,博士,E-mail:344775797@qq.com
作者简介:杨文灏(1994—),男,硕士研究生,主要研究方向为磁控溅射,E-mail:changge_ywh@163.com。
基金资助:
宁波市“科技创新2025”重大专项(2018B10066,2019B10102)

Influence of surface roughness on surface morphology and sputtering performance of magnetron sputtering etched area of pure Cu target

Yang Wenhao^1,2, Bao Mingdong¹, Tang Bin², Wang Yupeng², Zhao Guohua³, Wang Shuaikang², Wang Duo³

1. Department of Material and Chemical Engineering, Ningbo University of Technology, Ningbo Zhejiang 315211, China;
2. School of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan Shanxi 030024, China;
3. School of Materials Science and Engineering, Chang'an University, Xi'an Shaanxi 710061, China

Received:2021-03-27 Online:2021-08-25 Published:2021-12-09

摘要/Abstract

摘要： 通过将不同粗糙度的纯Cu试样安装在组合靶中以保证相同试验条件,采用白光干涉仪、离子镀膜机、电子分析天平和扫描电镜等方法研究了表面粗糙度对磁控溅射金属靶刻蚀区表面形貌及溅射性能的影响。结果表明,不同粗糙度的试样严重影响其溅射后的表面形貌,在靶材刻蚀最深区域出现凹坑和连续凸起分布的形貌,而在刻蚀较浅的区域出现了溅射蚀坑和不完全刻蚀的晶粒所形成的“亮点”;取向不同的晶粒内部和晶粒边界刻蚀后均出现台阶状形貌,但晶粒内部台阶高度和宽度远远小于晶粒边界,这是由于晶界刻蚀速率较晶粒内部快;表面初始粗糙度越大的试样溅射10 h后,其刻蚀最深区域的表面粗糙度越大;试样溅射过程的前10 h,初始表面粗糙度最小的试样其溅射产额最大。因此,可通过降低靶材表面粗糙度来增加薄膜沉积速率和溅射过程的稳定性。

关键词: 磁控溅射, 纯Cu靶材, 表面粗糙度, 表面形貌, 溅射性能

Abstract: By installing the pure Cu specimens with different roughness in the combined target to ensure the same tested conditions, and the influence of surface roughness on the surface morphology of the magnetron sputtering etched area of the metal target and its sputtering performance were studied by means of white-light interferometer, ion-plating machine, electronic analytical balance and SEM. The results show that the specimens with different roughness can seriously affect the surface morphologies after sputtering. Pits and continuous distributed protrusions are appeared in the deepest etched area of the target, while “bright spots” formed by sputtering pits and incompletely etched grains are appeared in the shallower etched areas. The inside of grains with different orientations and grain boundaries are etched with step-like morphologies, but the height and width of the steps in the grains are much smaller than that at grain boundaries, that is why the etching rate of the grain boundaries is faster than that of the grain internal. After sputtering for 10 h, the larger surface roughness of the initial specimens, the larger surface roughness in the deepest etched area. In the first 10 h of the sputtering process of the specimens, the smallest the initial surface roughness, the largest sputtering yield. Therefore, the film deposition rate and the stability of the sputtering process can be increased by reducing the surface roughness of the target material.

Key words: magnetron sputtering, pure Cu target, surface roughness, surface morphology, sputtering properties

中图分类号:

TG146.2⁺3

杨文灏, 鲍明东, 唐宾, 王钰鹏, 赵国华, 王帅康, 王铎. 表面粗糙度对磁控溅射纯Cu靶材刻蚀区表面形貌及溅射性能的影响[J]. 金属热处理, 2021, 46(8): 230-235.

Yang Wenhao, Bao Mingdong, Tang Bin, Wang Yupeng, Zhao Guohua, Wang Shuaikang, Wang Duo. Influence of surface roughness on surface morphology and sputtering performance of magnetron sputtering etched area of pure Cu target[J]. Heat Treatment of Metals, 2021, 46(8): 230-235.

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表面粗糙度对磁控溅射纯Cu靶材刻蚀区表面形貌及溅射性能的影响

Influence of surface roughness on surface morphology and sputtering performance of magnetron sputtering etched area of pure Cu target

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