Ni-Al-W活性材料的界面扩散动力学

doi:10.13251/j.issn.0254-6051.2021.07.019

金属热处理 ›› 2021, Vol. 46 ›› Issue (7): 98-102.DOI: 10.13251/j.issn.0254-6051.2021.07.019

Ni-Al-W活性材料的界面扩散动力学

于江涵¹, 耿铁强², 李文¹, 朱正旺², 张海峰²

1.沈阳理工大学材料科学与工程学院, 辽宁沈阳 110159;
2.中国科学院金属研究所, 辽宁沈阳 110016

收稿日期:2020-12-15 出版日期:2021-07-25 发布日期:2021-12-10
通讯作者: 李文,教授,博士,E-mail:liwen@sylu.edu.cn
作者简介:于江涵(1995—),男,硕士研究生,主要研究方向为含能金属材料的制备及性能,E-mail:1160232228@qq.com。

Interfacial diffusion kinetics of Ni-Al-W active materials

Yu Jianghan¹, Geng Tieqiang², Li Wen¹, Zhu Zhengwang², Zhang Haifeng²

1. School of Materials Science and Engineering, Shenyang Ligong University, Shenyang Liaoning 110159, China;
2. Institute of Metal Research, Chinese Academy of Sciences, Shenyang Liaoning 110016, China

Received:2020-12-15 Online:2021-07-25 Published:2021-12-10

摘要/Abstract

摘要： 采用粉末冶金法制备Ni-Al-W活性材料Ni_37.5Al_42.5W₂₀,研究了材料中Ni-Al、Al-W、Ni-W 3种不同界面处的扩散动力学。结果表明:在400 ℃保温不同时间下该材料表观激活能变化不大;扩散层厚度Δx随时间t的增加而增加,且lnΔx与lnt呈线性关系,在3种不同界面处只发生了扩散而未产生金属间化合物。Ni-Al界面层厚度与保温时间关系式为ΔxNi-Al=4.5210^-8t^1/2.635,界面扩散方式为晶格扩散中的体扩散机制;Al-W界面层厚度与保温时间关系式为ΔxAl-W=9.5610^-8t^1/4.050,界面扩散方式为表面扩散机制;Ni-W界面层厚度与保温时间关系式为ΔxNi-W=2.3310^-7t^1/6.534,界面扩散方式为表面扩散机制。

关键词: Ni-Al-W活性材料, 粉末冶金, 界面扩散, 生长动力学, 表观活化能

Abstract: Ni-Al-W active material Ni_37.5Al_42.5W₂₀was prepared by powder metallurgy method, and the diffusion kinetics of Ni-Al, Al-W and Ni-W interfaces in the material were studied. The results show that the apparent activation energy of the material has little change when annealing at 400 ℃ for different time. The thickness of diffusion layer Δx increases with the increase of time t, and lnΔx has a linear relationship with lnt, but no intermetallic compounds are produced. The relationship between the Ni-Al interface layer thickness and annealing time is Δx_Ni-Al=4.5210^-8t^1/2.635, the interface diffusion mode is volume diffusion in lattice. The relationship between the Al-W interface layer thickness and annealing time is Δx_Al-W=9.5610^-8t^1/4.050, the interface diffusion mode is surface diffusion. The relationship between the Ni-W interface layer thickness and annealing time is Δx_Ni-W=2.3310^-7t^1/6.534, the interface diffusion mode is surface diffusion.

Key words: Ni-Al-W active material, powder metallurgy, interfacial diffusion, growth kinetics, apparent activation energy

中图分类号:

TB34

于江涵, 耿铁强, 李文, 朱正旺, 张海峰. Ni-Al-W活性材料的界面扩散动力学[J]. 金属热处理, 2021, 46(7): 98-102.

Yu Jianghan, Geng Tieqiang, Li Wen, Zhu Zhengwang, Zhang Haifeng. Interfacial diffusion kinetics of Ni-Al-W active materials[J]. Heat Treatment of Metals, 2021, 46(7): 98-102.

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Ni-Al-W活性材料的界面扩散动力学

Interfacial diffusion kinetics of Ni-Al-W active materials

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