金属热处理 ›› 2021, Vol. 46 ›› Issue (12): 156-161.DOI: 10.13251/j.issn.0254-6051.2021.12.025

• 组织与性能 • 上一篇    下一篇

非平衡磁控溅射离子镀Cu-Nb纳米晶薄膜的微观结构及性能

王钰鹏1,2, 吴泓均2, 鲍明东2, 田武1,2, 周兵1   

  1. 1.太原理工大学 新型碳材料研究院, 山西 太原 030024;
    2.宁波工程学院 材料与化学工程学院, 浙江 宁波 315211
  • 收稿日期:2021-07-14 出版日期:2021-12-25 发布日期:2022-02-18
  • 通讯作者: 周 兵,副教授,博士,E-mail:zhoubing@tyut.edu.cn
  • 作者简介:王钰鹏(1995—),男,硕士研究生,主要研究方向为非平衡磁控溅射离子镀,E-mail:wangypedu@163.com。
  • 基金资助:
    宁波市科技创新2025重点科技项目(0080085190103)

Microstructure and properties of nanocrystalline Cu-Nb thin films prepared by unbalanced magnetron sputtering ion plating

Wang Yupeng1,2, Wu Hongjun2, Bao Mingdong2, Tian Wu1,2, Zhou Bing1   

  1. 1. Institute of New Carbon Materials, Taiyuan University of Technology, Taiyuan Shanxi 030024, China;
    2. School of Materials and Chemical Engineering, Ningbo Institute of Engineering, Ningbo Zhejiang 315211, China
  • Received:2021-07-14 Online:2021-12-25 Published:2022-02-18

摘要: 研究了Nb含量对纳米晶Cu-Nb薄膜微观结构和性能的影响。使用非平衡磁控溅射离子镀技术,在具有(100)晶面的单晶Si基体和玻璃基体上制备不同Nb含量的Cu-Nb纳米晶薄膜,研究Nb含量对纳米晶Cu-Nb薄膜微观结构和性能的影响。将样品置于卧式真空退火炉中进行400 ℃退火,用配备了能量色散X射线光谱仪的场发射扫描电镜、原子力显微镜、X射线衍射仪、纳米压痕仪和四探针电阻率测试仪等分析了退火前后薄膜的微观结构、力学性能与电学性能。结果表明,沉积态Cu-Nb薄膜表面由致密的纳米晶组成,表面粗糙度最高仅为8.54 nm,且无明显的孔洞和裂纹等缺陷。随着Nb含量的增加,薄膜的平均晶粒尺寸下降5 nm,薄膜的硬度也因细晶强化而有所增加,在靶电流为1.3 A时达到最大值4.9 GPa。退火态样品在硬度、弹性模量、平均晶粒尺寸和表面粗糙度方面与沉积态薄膜相比有较小的变化,Cu-Nb薄膜表现出优良的热稳定性。Nb的加入可有效细化晶粒,达到细晶强化的效果,同时Cu-Nb不互溶的特性使得纳米晶薄膜在高温下也可保持较好的热稳定性。Nb靶溅射电流为0.5 A 时薄膜综合性能最佳,此时沉积态Cu-Nb薄膜的电阻率最低,为3.798×10-7 Ω/m,硬度和弹性模量高达4.6 GPa和139.5 GPa,薄膜厚度为1050 nm,粗糙度Ra为4.70 nm。

关键词: 非平衡磁控溅射, Cu-Nb纳米晶薄膜, 电学及力学性能, 热稳定性

Abstract: Influence of Nb content on microstructure and properties of the nanocrystalline Cu-Nb film was studied. The Cu-Nb nanocrystalline films with different Nb content were prepared on single crystal Si substrate with (100) crystal plane and glass substrate by unbalanced magnetron sputtering ion plating technology, and the effect of Nb content on their microstructure and properties was studied. The specimens were annealed at 400 ℃ in a horizontal vacuum annealing furnace. The microstructure, mechanical properties and electrical properties of the films before and after annealing were analyzed by using a field emission scanning electron microscope equipped with energy dispersive X-ray spectrometer, atomic force microscope, X-ray diffraction and nanoindenter and four-probe resistivity tester. The results show that the as-deposited Cu-Nb film surface is composed of dense nanocrystallines without obvious defects such as holes and cracks, and with the highest surface roughness of only 8.54 nm. With the increase of Nb content, the average grain size of the film is decreased by 5 nm. The hardness of the film is also increased due to fine-grain strengthening, which showing a maximum value of 4.9 GPa with a Nb target current of 1.3 A. Compared with the as-deposited specimen, the as-annealed specimen has a little changes in hardness, elastic modulus, average grain size and surface roughness, which indicates that the as-annealed Cu-Nb film exhibits excellent thermal stability. The addition of Nb can effectively refine the grains and increase the hardness of the film. At the same time, the immiscibility of Cu-Nb allows the nanocrystalline film to maintain better thermal stability at high temperatures. When the sputtering current of Nb target is 0.5 A, the performance of the Cu-Nb film is the best: for the as-deposited Cu-Nb the resistivity is the lowest of 3.798×10-7 Ω/m, the film thickness is 1050 nm, the roughness is 4.70 nm, and the hardness and elastic modulus are as high as 4.6 GPa and 139.5 GPa, respectively.

Key words: unbalanced magnetron sputtering, nanocrystalline Cu-Nb thin film, electrical and mechanical properties, thermal stability

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