磁控溅射Cu-Cr合金薄膜与Sn-Ag-Cu焊料在时效处理时的界面反应
王钰鹏, 吴泓均, 鲍明东, 杨文灏, 赵国华, 周兵
Interfacial reaction of Sn-Ag-Cu solder with magnetron sputtered Cu-Cr alloy film during aging treatment
Wang Yupeng, Wu Hongjun, Bao Mingdong, Yang Wenhao, Zhao Guohua, Zhou Bing
金属热处理
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2021, (11): 103
-109
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DOI: 10.13251/j.issn.0254-6051.2021.11.016