以Cu基非晶为中间层的TiAl合金瞬时液相扩散连接界面组织及力学性能
彭伟, 张德闯, 唐德明, 林建国
Interfacial microstructure and strength of transient liquid-phase bonding of TiAl alloys with CuZrAl amorphous alloy interlayer
Peng Wei, Zhang Dechuang, Tang Deming, Lin Jianguo
金属热处理
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2014, (8): 5
-10
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DOI: 10.13251/j.issn.0254-6051.2014.08.002