熔覆电流对AlCrFeCoNiCu高熵合金涂层显微组织的影响
霍文燚, 时海芳, 张竞元
Effect of cladding current on microstructure of AlCrFeCoNiCu high-entropy alloy coating by argon arc cladding
Huo Wenyi, Shi Haifang, Zhang Jingyuan
金属热处理
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2014, (8): 24
-27
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DOI: 10.13251/j.issn.0254-6051.2014.08.006