Interfacial diffusion kinetics of Ni-Al-W active materials

doi:10.13251/j.issn.0254-6051.2021.07.019

Abstract

Abstract: Ni-Al-W active material Ni_37.5Al_42.5W₂₀was prepared by powder metallurgy method, and the diffusion kinetics of Ni-Al, Al-W and Ni-W interfaces in the material were studied. The results show that the apparent activation energy of the material has little change when annealing at 400 ℃ for different time. The thickness of diffusion layer Δx increases with the increase of time t, and lnΔx has a linear relationship with lnt, but no intermetallic compounds are produced. The relationship between the Ni-Al interface layer thickness and annealing time is Δx_Ni-Al=4.5210^-8t^1/2.635, the interface diffusion mode is volume diffusion in lattice. The relationship between the Al-W interface layer thickness and annealing time is Δx_Al-W=9.5610^-8t^1/4.050, the interface diffusion mode is surface diffusion. The relationship between the Ni-W interface layer thickness and annealing time is Δx_Ni-W=2.3310^-7t^1/6.534, the interface diffusion mode is surface diffusion.

Key words: Ni-Al-W active material, powder metallurgy, interfacial diffusion, growth kinetics, apparent activation energy

CLC Number:

TB34

Yu Jianghan, Geng Tieqiang, Li Wen, Zhu Zhengwang, Zhang Haifeng. Interfacial diffusion kinetics of Ni-Al-W active materials[J]. Heat Treatment of Metals, 2021, 46(7): 98-102.

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