Heat Treatment of Metals ›› 2021, Vol. 46 ›› Issue (8): 36-41.DOI: 10.13251/j.issn.0254-6051.2021.08.007

• MATERIALS RESEARCH • Previous Articles     Next Articles

Effect of Cu addition on microstructure and properties of SiCp/Al-Si composites

Ren Junpeng1, Wang Yu1, Dong Cuige2, Zhao Jun1   

  1. 1. School of Chemistry and Materials Science, Guizhou Education University, Guiyang Guizhou 510018, China;
    2. School of Materials Science and Engineering, Central South University, Changsha Hunan 410083, China
  • Received:2021-03-25 Online:2021-08-25 Published:2021-12-09

Abstract: Influence of different content of Cu addition on microstructure and properties of the SiCp/Al-Si composites prepared by powder metallurgy was studied by means of X-ray diffraction, scanning electron microscopy, precision electronic balance and universal testing machine. The results show that the addition of Cu element leads that the density, hardness, tensile strength, friction and wear resistance of the material are improved greatly, and the strength reaches the maximum when the Cu content is 4% (mass fraction). Since the Cu element is added in the form of copper powder in the matrix, a liquid phase can be formed through mutual diffusion at the Al-Cu boundary even at a lower temperature, thereby filling the gaps, holes and other defects in the matrix and at the interface. During rapid cooling of the green compact to room temperature, α-Al and Al2Cu phases are produced and both have strengthening effect on material, which improves the comprehensive mechanical properties of the SiCp/Al-Si composites.

Key words: SiCp/Al-Si composites, Cu element, SiC particles, microstructure, mechanical properties

CLC Number: