Effect of annealing temperature on interface phase evolution and properties of copper-aluminum clad plate

doi:10.13251/j.issn.0254-6051.2022.10.018

Abstract

Abstract: Effect of annealing temperature on interface phase evolution and properties of copper-aluminum clad plate prepared by cold rolling method was investigated. The interface structure was observed by electron probe micro-analyzer (EPMA). The phase composition was analyzed by using energy dispersive spectrometer (EDS) and X-ray diffractometer (XRD). The bonding properties of clad plate were characterized by using peel and tensile test. The results show that the diffusion layer at the bonding interface becomes thicker as the annealing temperature increases, which is composed of CuAl₂, Cu₉Al₄ and CuAl phases. CuAl₂ and CuAl phases destroy the interface bonding, which results in a significant drop in peel strength. When annealed at 300 ℃ or above, the clad plate recovers and recrystallizes, and its overall tensile properties are excellent. Considering the tensile properties and peel strength, the optimal annealing temperature of the copper-aluminum clad plate prepared by cold rolling method is 300 ℃.

Key words: copper-aluminum clad plate, annealing, intermetallic compound, bonding properties, tensile properties

CLC Number:

TB331

Zheng Weibo, Luo Zongan, Wang Mingkun, Xie Guangming, Wang Yuhao, Suo Jinggang. Effect of annealing temperature on interface phase evolution and properties of copper-aluminum clad plate[J]. Heat Treatment of Metals, 2022, 47(10): 113-118.

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