Effect of plastic deformation on diffusion bonding of 2219 aluminum alloy

doi:10.13251/j.issn.0254-6051.2024.02.016

Abstract

Abstract: Effect mechanism of plastic deformation on interface bonding of 2219 aluminum alloy by applying plastic deformation during holding was studied by diffusion bonding method. The diffusion bonding test was carried out at the diffusion temperature of 545 ℃, the holding time of 4 h, the pressure of 10 MPa with the plastic deformation of 0%, 10%, 30% and 50%. The results show that with the increase of plastic deformation, the interface is in a high energy state. The Al₂Cu phase at the interface is precipitated by solute atom diffusion, which encapsulates the original interface oxide and undergoes metallurgical reaction with oxide during heat preservation and deformation. The oxide decomposes and diffuses to the matrix till it disappears, achieving interface healing. The bonding strength reaches up to 116 MPa with plastic deformation of 50%, which is 90.6% of the base material.

Key words: 2219 aluminum alloy, diffusion bonding, hot pressing deformation, metallurgical reaction

CLC Number:

TG453.9

Chen Xi, Meng Linggang, Xu Dazhao, Zhou Bingwen, Ya Bin, Zhang Xingguo. Effect of plastic deformation on diffusion bonding of 2219 aluminum alloy[J]. Heat Treatment of Metals, 2024, 49(2): 104-112.

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