Heat Treatment of Metals ›› 2022, Vol. 47 ›› Issue (11): 156-159.DOI: 10.13251/j.issn.0254-6051.2022.11.028

• PROCESS RESEARCH • Previous Articles     Next Articles

Effect of annealing process on microstructure and properties of Cu-2Ag-0.075Y alloy wire bar

Zeng Yanqi1,2, Yu Huihui1,2, Li Jie3, Zou Jin1,2, Jiang Jiang1,2, Liu Qi1,2, Hu Xiaona1,2   

  1. 1. Institute of Applied Physics, Jiangxi Academy of Sciences, Nanchang Jiangxi 330096, China;
    2. Jiangxi Key Laboratory of Advanced Copper and Tungsten Materials, Jiangxi Academy of Sciences, Nanchang Jiangxi 330096, China;
    3. Jiangxi Chemical Industry School, Nanchang Jiangxi 330096, China
  • Received:2022-06-18 Revised:2022-09-20 Online:2022-11-25 Published:2023-01-04

Abstract: Cu-2Ag-0.075Y alloy wire bar was prepared by vacuum induction melting, hot forging and cold drawing, and then its microstructure and properties under different annealing processes were studied by means of tensile property test, conductivity test and microstructure observation. The results show that the tensile strength of the Cu-2Ag-0.075Y alloy wire bar first decreases significantly to 300-435 MPa with the extension of annealing time, then the decline rate slows down obviously, and finally tends to be stable. The higher the annealing temperature is, the lower the tensile strength is. The change law of elongation and conductivity is opposite to that of tensile strength. Firstly, they increase rapidly, then the increase rate slows down and finally tends to be stable. The specimens annealed at 550 ℃ can obtain higher elongation and conductivity. With the increase of annealing temperature and annealing holding time, the recrystallization degree of the Cu-2Ag-0.075Y alloy wire bar can be increased. Using 550 ℃×60 min annealing process, the Cu-2Ag-0.075Y alloy wire bar can obtain fine and uniform equiaxed grain microstructure, good matching of elongation and conductivity, which is conducive to the subsequent ultra-fine wire drawing process.

Key words: Cu-2Ag-0.075Y alloy, annealing process, microstructure, mechanical properties, conductivity

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