Microstructure and properties of pure copper wire after high temperature long time annealing

doi:10.13251/j.issn.0254-6051.2021.11.024

Abstract

Abstract: Multi-pass cold drawing deformation for ø8 mm annealed T2 pure copper bar was carried out by the industrial wire drawing machine, and the drawn specimen of ø3.5 mm was finally obtained. The annealing treatments at 600 ℃ for different time were carried out, and the relationship between the microstructure and properties was analyzed by observing the morphologies and testing the mechanical and electrical properties. The results show that the new recrystallization grains are formed and accompanied by increase of annealing twin ratio after annealing. As the annealing time increase, the recrystallized grains grow continuously, the tensile strength and elongation after breaking fluctuates slightly. The average tensile strength and the elongation of annealed wires are about 67.3% and 8 times of that of as-drawn wires, respectively, and the average conductivity of annealed wires is about 3.3% higher than that of as-drawn wires, and the conductivity is gradually improved with the annealing time increase.

Key words: pure copper, high temperature long time annealing, microstructure uniformity, mechanical properties, electrical properties

CLC Number:

TG156.2

Xiao Qiulei, Mao Xiqin, Ou Meigui, Liang Yu, Chen Desong. Microstructure and properties of pure copper wire after high temperature long time annealing[J]. Heat Treatment of Metals, 2021, 46(11): 152-156.

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