Effect of annealing on grain boundary characteristics distribution and conductivity of copper wire

doi:10.13251/j.issn.0254-6051.2021.09.014

Abstract

Abstract: Industrial pure copper wires prepared by the drawing method were annealed under different parameters, and the grain boundary characteristic distribution (GBCD) of the samples before and after annealing was tested by using electron backscatter diffraction (EBSD) technology. The results show that the conductivity and special grain boundary ratio of the copper wire are increased to a certain extent after annealing, and the conductivity increases with the Σ3 grain boundary ratio increasing, while the grain size has no obvious effect on conductivity. When annealed at 550 ℃ for 15 min, the proportion of special grain boundaries reaches the highest value of 57.59%, the proportion of Σ3 grain boundaries reaches the highest value of 49.80%, and the conductivity could reach 59.29%IACS, which is 2.56 times of that before annealing.

Key words: copper conductor, grain boundary characteristic distribution, electrical conductivity, annealing

CLC Number:

TG146.1

Zhu Ting, Lu Xianke, Yang Sen. Effect of annealing on grain boundary characteristics distribution and conductivity of copper wire[J]. Heat Treatment of Metals, 2021, 46(9): 85-89.

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