Effect of Ni-CNTs on interface behavior of Sn-3.0Ag-0.5Cu lead-free solder joints

doi:10.13251/j.issn.0254-6051.2021.12.018

Abstract

Abstract: Lead-free solder Sn-3.0Ag-0.5Cu with different contents(0,0.05,0.1,0.2,0.5wt%)of nickel-plated multi-walled carbon nanotubes (Ni-CNTs) was fabricated by mechanical mixing method, and reflow soldered with F4N furnace. The solder joints were aged in a vacuum drying oven at 170 ℃ for 0 and 48 h. The effect of Ni-CNTs content on wettability, melting point of Sn-3.0Ag-0.5Cu solder and the intermetallic compound (IMC) layer at the solder joints was studied by means of DTA, SEM, EDS and other analytical methods. The results show that the Ni-CNTs can significantly improve the wettability of the composite solder and reduce the melting point, also inhibit the growth of the interface IMC layer and change its composition. The optimal addition amount of Ni-CNTs is 0.05%. Compared with Sn-3.0Ag-0.5Cu solder, the wetting angle of Sn-3.0Ag-0.5Cu-0.05(Ni-CNTs) is reduced by 49.76%, the melting point is reduced by 0.331 ℃. The thickness of the interface IMC layer after aging is 4.292 μm (t=0 h) and 5.238 μm (t=48 h), which is reduced by 34.26%(t=0 h) and 36.55% (t=48 h), respectively, compared with Sn-3.0Ag-0.5Cu solder joints interface IMC thickness of 6.529 μm (t=0 h) and 8.255 μm (t=48 h), and the phase composition of the interface IMC layer changes to (Cu_1-xNi_x)₆Sn₅ and (Cu_1-xNi_x)₃Sn.

Key words: Ni-plated multi-walled carbon nanotubes(Ni-CNTs), Sn-3.0Ag-0.5Cu solder, aging, interface IMC layer

CLC Number:

TG425⁺.1

Chen Jin, Qu Min, Cui Yan. Effect of Ni-CNTs on interface behavior of Sn-3.0Ag-0.5Cu lead-free solder joints[J]. Heat Treatment of Metals, 2021, 46(12): 113-118.

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