Effect of heat treatment on low temperature brazing of copper and aluminum

doi:10.13251/j.issn.0254-6051.2022.06.014

Abstract

Abstract: Effect of heat treatment temperature and holding time on strength of Al/Sn-Bi/Cu joints brazed at low temperature was studied. The microstructure of the joint interface and the fracture surface morphology were analyzed by means of optical microscope and scanning electron microscopy. The results show that with the increase of heat treatment temperature, the shear strength of welded parts shows an increasing trend. With the increase of heat treatment time, the shear strength of Al/Sn-Bi/Cu joints increases first and then decreases. During brazing, copper and aluminum elements enter the brazing layer, mainly exist in the form of Cu-Al solid solution, and accumulate with the prolongation of heat treatment time. Heat treatment makes the coarse and brittle Sn-Bi eutectic structure in the brazing seam finer and reduces the coverage area to increase the strength of the joint. The aggregation and growth of Cu-Al solid solution decrease the strength of the joint.

Key words: copper aluminum compound materials, low temperature brazing, Sn-Bi solder, microstructure

CLC Number:

Xu Xinquan, Fang Zhou, Liu Xinkuan, Wang Ziyan. Effect of heat treatment on low temperature brazing of copper and aluminum[J]. Heat Treatment of Metals, 2022, 47(6): 78-84.

References

[1]路希龙, 刘平, 刘新宽, 等. 铪与铜钎焊接头的组织与强度[J]. 稀有金属, 2014, 38(1): 22-27.
Lu Xilong, Liu Ping, Liu Xinkuan, et al. Microstructure and strength of hafnium and copper brazing joints[J]. Rare Metals, 2014, 38(1): 22-27.
[2]王征, 刘平, 刘新宽, 等. 铜热浸镀铝扩散层生长动力学模型[J]. 功能材料, 2015, 46(2): 2080-2083.
Wang Zheng, Liu Ping, Liu Xinkuan, et al. Growth dynamics model of diffusion layer of copper hot dip aluminum plating[J]. Functional Materials, 2015, 46(2): 2080-2083.
[3]Lacaze J, Tierce S, Lafont M C, et al. Study of the microstructure resulting from brazed aluminum materials used in heat exchangers[J]. Materials Science and Engineering, 2005, 413(12): 317-321.
[4]刘小娣, 杨毅, 李凤生. 化学镀法制备纳米Cu/Al复合粉末[J]. 功能材料, 2006, 37(8): 1335-1337.
Liu Xiaodi, Yang Yi, Li Fengsheng. Preparation of Cu/Al nanocomposite powders by electroless plating[J]. Functional Materials, 2006, 37(8): 1335-1337.
[5]Pourahmad P. Materials flow and phase transformation in friction stir welding of Al6013/Mg[J]. Chinese Journal of Nonferrous Metals, 2013, 23(5): 1253-1261.
[6]Bahmanpour H, Kauffmann A, Khoshkhoo M S, et al. Effect of stacking fault energy on deformation behavior of cryo-rolled copper and copper alloys[J]. Materials Science and Engineering A, 2011, 35(529): 230-236.
[7]刘帅洋, 王爱琴, 吕世敬, 等. 铜铝层状复合材料界面特性及深加工研究进展[J]. 材料导报, 2018, 32(5): 828-835.
Liu Shuaiyang, Wang Aiqin, Lü Shijing, et al. Research progress on interface properties and deep processing of copper aluminum laminated composites[J]. Materials Review, 2018, 32(5): 828-835.
[8]曹凯, 刘平, 刘新宽, 等. 无镀镍铜铝低温钎焊工艺研究[J]. 有色金属材料与工程, 2018, 39(6): 1-6.
Cao Kai, Liu Ping, Liu Xinkuan, et al. Study on low-temperature brazing technology of copper and aluminum without nickel plating[J]. Nonferrous Metal Materials and Engineering, 2018, 39(6): 1-6.
[9]Liu Yun, Yu Weiyuan, Liu Yingzong, et al. Effect of ultrasound on dissolution of Al in Sn[J]. Ultrasonics Sonochemistry, 2019, 50: 67-73.
[10]于汉臣, 张汇文, 闫久春. 5A06铝合金/T2紫铜镶嵌结构件超声波复合钎焊[J]. 机械工程师, 2020, 54(8): 18-23.
Yu Hanchen, Zhang Huiwen, Yan Jiuchun. Ultrasonic composite brazing of 5A06 aluminum alloy/T2 copper mosaic structure[J]. Mechanical Engineer, 2020, 54(8): 18-23.
[11]张洋, 闫久春, 陈晓光. SiC_P/A356 复合材料超声波辅助钎焊[J]. 焊接学报, 2009, 30(3): 89-92.
Zhang Yang, Yan Jiuchun, Chen Xiaoguang. Ultrasonic assisted brazing of SiC_P/A356 composites[J]. Transactions of the China Welding Institution, 2009, 30(3): 89-92.
[12]Jáňa M, Turňa M, MarÔnek M, et al. Application of a ternary Zn-based solder alloy for joining of AZ31B magnesium alloy with ultrasonic support[J]. Advanced Materials Research, 2015, 1077: 82-88.
[13]左晓姣. 铜铝复合板界面扩散层组织结构与性能的研究[D]. 沈阳: 沈阳工业大学, 2017.
Zuo Xiaojiao. Study on microstructure and properties of interfacial diffusion layer of copper-aluminum composite plate[D]. Shenyang: Shenyang University of Technology, 2017.
[14]曹飞. Al/Cu双金属复层材料界面扩散行为及微观组织演变[D]. 大连: 大连理工大学, 2018.
Cao Fei. Diffusion behavior and microstructural evolution on interfaces in Al/Cu bimetal[D]. Dalian: Dalian University of Technology, 2018.
[15]宁江天. 低熔点锡铋合金无铅钎料脆性机理及韧化机制的研究[J]. 焊接技术, 2019, 48(5): 80-85.
Ning Jiangtian. Study on brittleness mechanism and toughening mechanism of low melting point Sn-Bi alloy lead-free solder[J]. Welding Technology, 2019, 48(5): 80-85.
[16]Zhang Huiwen, Cui Wei, He Jingshan, et al. Formation and evolution of intermetallic compounds at interfaces of Cu/Al joints by ultrasonic-assisted soldering[J]. Journal of Materials Processing Technology, 2015, 33(223): 1-7.
[17]林国标, 王自东, 张伟, 等. 热处理对锡青铜合金组织和性能的影响[J]. 铸造, 2011, 60(3): 287-289, 293.
Lin Guobiao, Wang Zidong, Zhang Wei, et al. Effects of heat treatment on microstructure and performance of tin bronze alloy[J]. Foundry, 2011, 60(3): 287-289, 293.
[18]肖勇. 超声波辅助Cu/Al液相钎焊接头冶金连接机制及性能研究[D]. 哈尔滨: 哈尔滨工业大学, 2014.
Xiao Yong. Study on the metallurgic bonding mechanism and properties of liquid phase brazed Cu/Al joints with the assistance of ultrasound[D]. Harbin: Harbin Institute of Technology, 2014.