Effects of S content and aging on reliability of Cu/Sn-8Zn-3Bi-xS/Cu solder joints

doi:10.13251/j.issn.0254-6051.2024.05.022

Abstract

Abstract: Effects of S addition and aging on the reliability of Cu/Sn-8Zn-3Bi-xS/Cu solder joints were investigated. The wettability of the solder was evaluated by spreading area on Cu substrate. The Cu/Sn-8Zn-3Bi-xS/Cu solder joints were prepared by lap welding and the mechanical properties of the solder joints aged at 90 ℃ for different time were measured. The morphology and constituents of the fracture surface of the solder joints were observed by scanning electron microscopy (SEM), and the intermetallic compounds formed at the interface of the solder joints were identified by X-ray diffractometer (XRD). The results show that the wettability of the Sn-8Zn-3Bi-xS solder enhances by the addition of S, and the optimal S content is 0.05wt%. When the aging time is the same, the shear strength of the solder joints increases first and then decreases with the increase of S content and reaches the maximum value when the S content is 0.05wt%. When the S content is the same, the shear strength of the solder joints increases first and then decreases with the increase of aging time. When aging time is 4 h, the shear strength is the maximum. Addition of S does not change the composition of intermetallic compounds at the solder joints interface.

Key words: Sn-Zn solder, S content, aging, reliability

CLC Number:

TG425

Shuai Gewang, Huang Huizhen. Effects of S content and aging on reliability of Cu/Sn-8Zn-3Bi-xS/Cu solder joints[J]. Heat Treatment of Metals, 2024, 49(5): 135-139.

References

[1]景博, 胡家兴, 黄以锋, 等. 电子设备无铅焊点的热疲劳评估进展与展望[J]. 空军工程大学学报(自然科学版), 2016, 17(6): 35-40.
Jing Bo, Hu Jiaxing, Huang Yifeng, et al. Evaluation and prospect of thermal fatigue on lead-free solder joints in electronic equipment[J]. Journal of Air Force Engineering University (Natural Science Edition), 2016, 17(6): 35-40.
[2]陈进, 屈敏, 崔岩. 镀镍多壁碳纳米管对Sn-3.0Ag-0.5Cu无铅钎料焊点界面行为的影响[J]. 金属热处理, 2021, 46(12): 113-118.
Chen Jin, Qu Min, Cui Yan. Effect of Ni-CNTs on interface behavior of Sn-3.0Ag-0.5Cu lead-free solder joints[J]. Heat Treatment of Metals, 2021, 46(12): 113-118.
[3]王剑豪, 薛松柏, 马超力, 等. 特殊环境用无铅钎料可靠性研究进展[J]. 中国有色金属学报, 2018, 28(12): 2499-2511.
Wang Jianhao, Xue Songbai, Ma Chaoli, et al. Research progress on reliability of lead-free solders under special conditions[J]. The Chinese Journal of Nonferrous Metals, 2018, 28(12): 2499-2511.
[4]乔健, 刘政, 高惠明, 等. 时效时间对Cu/In-Sn-2.5Ag/Cu焊点组织形貌及剪切性能的影响[J]. 金属热处理, 2021, 46(9): 104-107.
Qiao Jian, Liu Zheng, Gao Huiming, et al. Effect of aging time on microstructure and shear properties of Cu/In-Sn-2.5Ag/Cu solder joint[J]. Heat Treatment of Metals, 2021, 46(9): 104-107.
[5]陈海燕, 赵敏, 揭晓华, 等. Sn-Ag-Cu无铅焊料及焊点在低温下组织和性能[J]. 材料热处理学报, 2014, 35(10): 82-87.
Chen Haiyan, Zhao Min, Jie Xiaohua, et al. Microstructure and properties of Sn-Ag-Cu solder and its joints under low temperature[J]. Transactions of Materials and Heat Treatment, 2014, 35(10): 82-87.
[6]Peng W Q, Monlevade E, Marques M E, et al. Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu[J]. Microelectronics Reliability, 2007, 47(12): 2161-2168.
[7]孙磊, 张亮, 钟素娟, 等. Sn-3.0Ag-0.5Cu/Cu焊点可靠性研究[J]. 电子工艺技术, 2015, 36(4): 187-190, 202.
Sun Lei, Zhang Liang, Zhong Sujuan, et al. Reliability studies of Sn-3.0Ag-0.5Cu solder joints[J]. Electronics Process Technology, 2015, 36(4): 187-190, 202.
[8]徐恺恺, 张亮, 孙磊, 等. Sn-Zn钎料的研究进展[J]. 机械工程材料, 2020, 44(6): 1-5, 32.
Xu Kaikai, Zhang Liang, Sun Lei, et al. Research progress on Sn-Zn solder[J]. Materials for Mechanical Engineering, 2020, 44(6): 1-5, 32.
[9]赵柏森, 赵国际. 85 ℃时效Sn-8Zn-3Bi/Cu焊点界面化合物生长行为[J]. 特种铸造及有色合金, 2015, 35(1): 91-93.
Zhao Baisen, Zhao Guoji. Growth behavior of interfacial compounds in Sn-8Zn-3Bi/Cu joints with aging at 85 ℃[J]. Special Casting and Nonferrous Alloys, 2015, 35(1): 91-93.
[10]Alam S N, Mishra M K, Padhy M, et al. Development and characterization of Sn-Zn-Bi lead-free solder[J]. Transactions of the Indian Institute of Metals, 2015, 68(5): 881-896.
[11]Wei X Q, Li Y H, Huang H Z. Effects of sulfur on the properties of Sn-9Zn as lead-free solder[J]. Journal of Electronic Materials, 2017, 46(2): 1067-1071.
[12]Miller J B, Morreale B D, Gellman A J. The effect of adsorbed sulfur on surface segregation in apolycrystalline Pd70Cu30 alloy[J]. Surface Science, 2008, 602: 1817-1825.
[13]杨晓华, 杨思佳, 兑卫真, 等. SnAgCu/Cu钎焊接头热循环时效组织与性能[J]. 材料热处理学报, 2018, 39(4): 145-150.
Yang Xiaohua, Yang Sijia, Dui Weizhen, et al. Microstructure and mechanical properties of SnAgCu/Cu solder joint during thermal cycle[J]. Transactions of Materials and Heat Treatment, 2018, 39(4): 145-150.
[14]谷柏松, 孟工戈, 孙凤莲, 等. Sn-3.0Ag-0.5Cu/Ni/Cu微焊点剪切强度与断口的研究[J]. 电子元件与材料, 2013, 32(3): 70-72, 76.
Gu Baisong, Meng Gongge, Sun Fenglian, et al. Research on micro solder joint shear strength and fracture of Sn-3.0Ag-0.5Cu/Ni/Cu[J]. Electronic Components and Materials, 2013, 32(3): 70-72, 76.
[15]Kim S H, Kim Y J, Lim T S, et al. Reduced electrical resistivity of ternary solder alloy of tin-copper-sulfur: An anti-oxidative role of sulfur in binary solder alloy of tin-copper[J]. Materials Transactions, 2014, 55(9): 1513-1516.
[16]胡玉华, 薛松柏, 杨晶秋, 等. 时效对Sn-Zn无铅钎料焊点可靠性的影响[J]. 焊接学报, 2012, 33(3): 41-44, 115.
Hu Yuhua, Xue Songbai, Yang Jingqiu, et al. Effects of aging treatment on reliability of SnZn soldered joints[J]. Transactions of the China Welding Institution, 2012, 33(3): 41-44, 115.
[17]Ma J S, Chen G H, Li X Y, et al. Study of new types lead-free solder alloys of Sn-Ag-Cu-Al-Ni and Sn-Zn-Bi-In-P[C]//7th International Conference on Electronics Packaging Technology (IEEE-ICEPT). Shanghai, 2006.
[18]李芳, 李才巨, 彭巨擘, 等. 锡锌系无铅钎料合金化研究进展[J]. 材料导报, 2022, 36(13): 191-200.
Li Fang, Li Caiju, Peng Jubo, et al. Research progress on the alloying of Sn-Zn lead-free solder[J]. Materials Reports, 2022, 36(13): 191-200.