Effect of annealing on bonding interface microstructure and properties of TA1/5052 explosive welded composite plates
Zhang Zhen, Ding Xu, Wang Xiaomiao, Zou Jie, Tian Xiaodong, Luo Hailong
2022, 47(5):
118-125.
doi:10.13251/j.issn.0254-6051.2022.05.019
Abstract
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TA1/5052 explosive welded composite plates were annealed at 350, 400 and 450 ℃ for 1, 3, 6 and 9 h, respectively. The microstructure and properties of the composite plates before and after annealing were studied. The results show that with the increase of annealing temperature, atomic diffusion intensifies and the diffusion layer formed at the interface becomes thicker. During annealing process, aluminum diffuses easily to the titanium side, while the bright white band and Kirkendall hole are mainly located in the side of 5052 aluminum alloy near the interface. The phase composition at the interface before annealing is α-Ti, α-Al and TiAl3. After annealing at 350, 400 ℃ for 3 h and at 450 ℃ for 1, 3, 6, and 9 h, the phase composition is unchanged. After annealing at different temperatures, the tensile strength of the interface of the composite plates is lower than that before annealing, while the area shrinkage and elongation are significantly higher than that before annealing. The analysis of tensile fracture shows that the TAl side is ductile brittle mixed fracture with brittle fracture as the main and ductile fracture as the auxiliary, and the 5052 side is ductile fracture. When annealed at 350 ℃, the interfacial shear strength and peel strength of the composite plates are the highest, which is increased by 8.24% and 45.68%, respectively, compared with the explosion state. With the increase of annealing temperature, the interfacial shear strength and peel strength decreases. The hardness of the interface bonding zone before and after annealing is higher than that of both sides of the base plate, and with the increase of the distance from the interface, the hardness gradually decreases to the hardness of the base metal on both sides of Ti/Al. The hardness of the interface bonding zone after annealing is significantly lower than that of the explosion state.