磁控溅射Cu-Cr合金薄膜与Sn-Ag-Cu焊料在时效处理时的界面反应

doi:10.13251/j.issn.0254-6051.2021.11.016

金属热处理 ›› 2021, Vol. 46 ›› Issue (11): 103-109.DOI: 10.13251/j.issn.0254-6051.2021.11.016

磁控溅射Cu-Cr合金薄膜与Sn-Ag-Cu焊料在时效处理时的界面反应

王钰鹏^1,2, 吴泓均¹, 鲍明东¹, 杨文灏^1,2, 赵国华^1,3, 周兵²

1.宁波工程学院材料与化学工程学院, 浙江宁波 315211;
2.太原理工大学新型碳材料研究院, 山西太原 030024;
3.长安大学材料科学与工程学院, 陕西西安 710061

收稿日期:2021-05-27 出版日期:2021-11-25 发布日期:2021-12-08
通讯作者: 吴泓均,副教授,博士,E-mail:p06546002@ntu.edu.tw
作者简介:王钰鹏(1995—),男,硕士研究生,主要研究方向为磁控溅射薄膜,E-mail:wangypedu@163.com。
基金资助:
宁波市“科技创新2025”重大专项(2018B10066)

Interfacial reaction of Sn-Ag-Cu solder with magnetron sputtered Cu-Cr alloy film during aging treatment

Wang Yupeng^1,2, Wu Hongjun¹, Bao Mingdong¹, Yang Wenhao^1,2, Zhao Guohua^1,3, Zhou Bing²

1. Department of Material and Chemical Engineering, Ningbo Institute of Engineering, Ningbo Zhejiang 315211, China;
2. Institute of New Carbon Materials, Taiyuan University of Technology, Taiyuan Shanxi 030024, China;
3. School of Materials Science and Engineering, Chang'an University, Xi'an Shaanxi 710061, China

Received:2021-05-27 Online:2021-11-25 Published:2021-12-08

摘要/Abstract

摘要： 采用磁控溅射的方式沉积不同Cr含量的Cu-Cr合金薄膜,通过与Sn-Ag-Cu(SAC)焊料在240 ℃下回焊形成焊点结构,然后将试样置于180 ℃下进行真空时效处理。研究Cu-Cr合金作为凸点下金属化(UBM)层时与SAC形成焊点的焊接可靠性。使用配备能量色散X射线光谱仪的场发射扫描电镜和多功能推力测试仪等分析界面金属间化合物(IMC)的形貌及焊点的剪切强度。结果表明,SAC/Cu-Cr焊点结构在回焊后形成了不同于传统的SAC/Cu焊点扇贝状IMC的针状IMC。在时效处理后,Cr在晶界处的偏析形成了富铬层,其作为扩散阻挡层阻碍Cu扩散到IMC中,使得Cu₃Sn和柯肯达尔空洞的生长受到抑制。剪切强度测试结果表明,回焊后SAC/Cu-Cr试样比SAC/Cu试样具有更高的剪切强度。Cr靶电流为1.5 A的Cu-Cr合金UBM层形成的焊点结构具有较小的IMC厚度,且拥有最高的焊点剪切强度。证实了Cu-Cr 合金UBM层有利于提高焊接可靠性。

关键词: 非平衡磁控溅射, Cu-Cr 合金凸点下金属化层, Sn-Ag-Cu 焊料, 时效处理, 界面反应

Abstract: Cu-Cr alloy films with different content of Cr was deposited by magnetron sputtering. The solder joint structure was formed by reflow soldering with Sn-Ag-Cu (SAC) solder at 240 ℃, and then the specimens were vacuum aged at 180 ℃. The soldering reliability of the Cu-Cr alloy as under bump metallization layer (UBM layer) forming solder joint with SAC was studied. The morphology of interfacial intermetallic compound (IMC) and the shear strength of solder joint were analyzed by field emission scanning electron microscope equipped with energy dispersive X-ray spectrometer and multifunctional thrust tester. The results show that needle-like IMC, which is different from the traditional SAC/Cu interface scallop-like IMC, is formed in the SAC/Cu-Cr solder joint after reflow soldering. After aging, the segregation of Cr at the grain boundary forms a chromium rich layer, which acts as a diffusion barrier to prevent the diffusion of Cu into IMC, so that the growth of Cu₃Sn and Kirkendal void is inhibited. The shear strength test results show that the SAC/Cu-Cr specimen after reflow soldering has higher shear strength than that of the SAC/Cu specimen. The solder joint structure formed by the Cu-Cr alloy UBM layer with a Cr target current of 1.5 A has smaller IMC thickness and the highest solder joint shear strength. It is confirmed that the Cu-Cr alloy UBM layer is beneficial to improve soldering reliability.

Key words: unbalanced magnetron sputtering, Cu-Cr alloy UBM layer, Sn-Ag-Cu solder, aging treatment, interfacial reaction

中图分类号:

TB43

王钰鹏, 吴泓均, 鲍明东, 杨文灏, 赵国华, 周兵. 磁控溅射Cu-Cr合金薄膜与Sn-Ag-Cu焊料在时效处理时的界面反应[J]. 金属热处理, 2021, 46(11): 103-109.

Wang Yupeng, Wu Hongjun, Bao Mingdong, Yang Wenhao, Zhao Guohua, Zhou Bing. Interfacial reaction of Sn-Ag-Cu solder with magnetron sputtered Cu-Cr alloy film during aging treatment[J]. Heat Treatment of Metals, 2021, 46(11): 103-109.

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磁控溅射Cu-Cr合金薄膜与Sn-Ag-Cu焊料在时效处理时的界面反应

Interfacial reaction of Sn-Ag-Cu solder with magnetron sputtered Cu-Cr alloy film during aging treatment

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