Effect of grain size of magnetron sputtering copper target on sputtering performance and deposition performance

doi:10.13251/j.issn.0254-6051.2022.11.044

Abstract

Abstract: Three 6N high-purity copper square targets with average grain sizes of 30 μm, 70 μm and 150 μm respectively were placed in the same sputtering system for sputtering. The I-V characteristic curve, mass loss, and surface morphology, thickness and X-ray diffraction pattern of the coated film were detected and observed after sputtering. The results show that the grain size, as an important parameter of the target, affects the surface morphology and I-V characteristic curve of the target after sputtering. When the deposited film is thicker, the target grain size doesn't have much influence on mass loss of the target and the film crystallization, but the film deposition rate appears to be quite different.

Key words: magnetron sputtering, copper target, target grain size, sputtering performance, deposition performance

CLC Number:

TG146.2⁺3

Wang Shuaikang, Tang Bin, Bao Mingdong, Zhan Shangsong, Wang Duo, Yi Chenxi. Effect of grain size of magnetron sputtering copper target on sputtering performance and deposition performance[J]. Heat Treatment of Metals, 2022, 47(11): 261-265.

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